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2019 |
Air chamber cavity for MEMS microphone was developed for production. |
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200G, 400G Optical transceiver were developed for mass production. |
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| 2018 |
TBGA was developed and qualified for networking, automotive and airospace applications. |
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22um RF module by ELIC technology was developed and ready for volume production. |
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| 2016 |
Cu core substrate technology was successfully developed and apply to mobile phone camera module for US mobile phone company. |
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100G CWDM4 by Silicon Photonics Optical Transceiver was developed with embedded ceramics apply to hyper scale data center. |
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Qualified of wireless ear phone sensors, environment light sensor and proximity sensors for US mobile phones in high volume production. |
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Substrate for Bio sensor was qualified applied to smart watch. |
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Substrate for IRIS sensor was qualified for Korean mobile phone customer. |
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2015 |
25um RF module by ELIC technology was successfully developed for mass production. |
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Embedded MOSFET was successfully developed for power module for European semiconductor company. |
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Embedded Cu Slug was developed for PA modules on wireless communication station. |
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2014 |
Pressure Sensor substrate was qualified by Eurpean MEMS sensor company and ship to European automotives. |
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2012 |
High heat dissipation Copper stack substrate was developed for European LED company mass production. |
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2010 |
Every Layer Interconnection technology was developed to apply to new RF modules for mobile phones. |
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2009 |
High Power LED substrate was developed for lighting applications. |
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2002 |
RF module qualified and ship to European mobile phones. |
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2000 |
Unimicron Group took over high level management. |
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1998 |
Start production of traditional PCB and substrate for PBGA. |