Substrate for RF Application Key Technologies
| Substrate Type | Technology Specialties |
| SIP Substrate for : RF FE Modules PA Modules Connectivity Modules (wifi, bluetooth, … etc.)
|
More than 15 years HVM experiences in mobile phone RF module substrates. |
| High layer count, fine pitch with thin substrate for high level design integration. | |
| Embedded inductor / coil structure with high precision layer to layer registration. | |
| Embedded thin film capacitor, resistor and component technology. | |
| Signal integrity in NPI stage interaction in material, structure, circuit design, …, etc | |
| Signal Integrity in HVM stage by process control of metal thickness, dielectric thickness, line width tolerance, surface roughness, …, etc | |
| Thermal solutions for the design option. | |
| Dimension control for fine pitch SMT processing. | |
| Automation in backend inspection system, e-mapping system, 2DID for lot tracking system. |